Display device and manufacturing method thereof

ABSTRACT

A manufacturing method of a display device is provided. The manufacturing method of the display device includes forming a switching structure. The switching structure includes a plurality of switching elements. The manufacturing method of the display device also includes forming a light-emitting structure. The light-emitting structure includes a plurality of light-emitting elements. The manufacturing method of the display device further includes arranging the light-emitting structure on the switching structure, so that each of the light-emitting elements is above each of the switching elements. The manufacturing method of the display device includes connecting each of the light-emitting elements to a corresponding switching element via a laser.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of Taiwan Application No. 109114769,filed May 4, 2020, the entirety of which is incorporated by referenceherein.

BACKGROUND Technical Field

Embodiments of the present disclosure relate to a display device and amanufacturing method thereof, and in particular they relate to a displaydevice with high resolution and a manufacturing method thereof.

Description of the Related Art

Light-emitting diodes (LED) have the advantages of high brightness, highcontrast, wide-viewing angle, long life, low power consumption and soon. Therefore, light-emitting diodes have been widely used in displaydevices. With the technological improvement of light-emitting diodes,the development of micro-based light-emitting diodes (micro-LED, mLED,or μLED), for example, is attractive, and it is expected that thesemicro-based light-emitting diodes will be applied to high-quality,high-resolution display devices. However, there are many technicalchallenges in the implementation of light-emitting diodes.

For example, flip-chip bonding or wire bonding is generally used to bonda micro LED chip to a driving circuit to achieve pixel display lightemission. As a result, the size of the micro LED chip is limited andcannot be reduced any further, making it impossible to achieve a highresolution. Although the use of die transfer and photolithographytechniques may allow smaller-sized micro LED chip to be bonded to thedriving circuit, it requires a more complicated process and uses morephotomasks, resulting in higher manufacturing costs.

BRIEF SUMMARY

The embodiments of the present disclosure relate to a display devicewith high resolution and a manufacturing method thereof. Through themanufacturing method according to the embodiments of the presentdisclosure, the light-emitting elements of the light-emitting structure(e.g., a structure including micro LED chips) may be stacked on thecorresponding switching elements in the switching structure (e.g., astructure including thin film transistor (TFT)), which may effectivelyreduce the size of a single pixel to achieve high resolution. Moreover,the manufacturing method according to the embodiments of the presentdisclosure does not require a complicated process or the use of morephotomasks. That is, the display device with high resolution may becompleted at a lower manufacturing cost.

In accordance with some embodiments of the present disclosure, amanufacturing method of a display device is provided. The manufacturingmethod of the display device includes forming a switching structure. Theswitching structure includes a plurality of switching elements. Themanufacturing method of the display device also includes forming alight-emitting structure. The light-emitting structure includes aplurality of light-emitting elements. The manufacturing method of thedisplay device further includes arranging the light-emitting structureon the switching structure, so that each of the light-emitting elementsis above each of the switching elements. The manufacturing method of thedisplay device includes connecting each of the light-emitting elementsto a corresponding switching element via a laser.

In accordance with some embodiments of the present disclosure, a displaydevice is provided. The display device includes a switching structurethat includes a plurality of switching elements. The display device alsoincludes a light-emitting structure disposed on the switching structure,and the light-emitting structure includes a plurality of light-emittingelements. Each of the light-emitting elements is disposedcorrespondingly on one of the switching elements, and each of thelight-emitting elements is connected to the corresponding switchingelement.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure can be more fully understood from the following detaileddescription when read with the accompanying figures. It is worth notingthat, in accordance with standard practice in the industry, variousfeatures are not drawn to scale. In fact, the dimensions of the variousfeatures may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1A-1F are cross-sectional views illustrating various stages ofmanufacturing the switching structure according to one embodiment of thepresent disclosure.

FIGS. 2A-2E are cross-sectional views illustrating various stages ofmanufacturing the light-emitting structure according to one embodimentof the present disclosure.

FIG. 3A is a cross-sectional view illustrating a display deviceaccording to one embodiment of the present disclosure.

FIG. 3B is an example of a partial top view of the display device.

FIG. 3C is another example of a partial top view of the display device.

FIG. 4 is a cross-sectional view illustrating a display device accordingto another embodiment of the present disclosure.

FIG. 5 is a cross-sectional view illustrating a display device accordingto another embodiment of the present disclosure.

FIG. 6 is a cross-sectional view illustrating a display device accordingto another embodiment of the present disclosure.

FIGS. 7A-7C are cross-sectional views illustrating various stages ofcombining the light-emitting structure and the switching structureaccording to one embodiment of the present disclosure.

FIGS. 8A-8B are cross-sectional views illustrating various stages ofcombining the light-emitting structure and the switching structureaccording to another embodiment of the present disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the subject matterprovided. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, a firstfeature is formed on a second feature in the description that followsmay include embodiments in which the first feature and second featureare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first feature and secondfeature, so that the first feature and second feature may not be indirect contact.

It should be understood that additional steps may be implemented before,during, or after the illustrated methods, and some steps might bereplaced or omitted in other embodiments of the illustrated methods.

Furthermore, spatially relative terms, such as “beneath,” “below,”“lower,” “on,” “above,” “upper” and the like, may be used herein forease of description to describe one element or feature's relationship toother elements or features as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

In the present disclosure, the terms “about,” “approximately” and“substantially” typically mean+/−20% of the stated value, more typically+/−10% of the stated value, more typically +/−5% of the stated value,more typically +/−3% of the stated value, more typically +/−2% of thestated value, more typically +/−1% of the stated value and even moretypically +1-0.5% of the stated value. The stated value of the presentdisclosure is an approximate value. That is, when there is no specificdescription of the terms “about,” “approximately” and “substantially”,the stated value includes the meaning of “about,” “approximately” or“substantially”.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure belongs. It shouldbe understood that terms such as those defined in commonly useddictionaries should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an idealized or overly formal sense unlessexpressly so defined in the embodiments of the present disclosure.

The present disclosure may repeat reference numerals and/or letters infollowing embodiments. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

In the embodiments of the present disclosure, a manufacturing method ofa display device is provided. The manufacturing method includes forminga switching structure including a plurality of switching elements (e.g.,film transistor (TFT)) and forming a light-emitting structure includinga plurality of light-emitting elements (e.g., micro LED chips), and eachlight-emitting element is connected to a corresponding switching elementvia a laser. That is, in the manufacturing method of the display deviceaccording to the embodiments of the present disclosure, thelight-emitting structure is stacked on the corresponding switchingstructure, so that each light-emitting element is disposed on thecorresponding switching element, which may effectively reduce the sizeof a single pixel to achieve high resolution.

Moreover, since each light-emitting element is connected to thecorresponding switching element via a laser in the manufacturing methodof the display device according to the embodiments of the presentdisclosure, it does not require a complicated process or use morephotomasks. As a result, a display device with high resolution may becompleted at a lower manufacturing cost. The following will explain indetail, accompanied by the drawings.

FIGS. 1A-1F are cross-sectional views illustrating various stages ofmanufacturing the switching structure 100 according to one embodiment ofthe present disclosure. It should be noted that some components may beomitted in FIGS. 1A-1F in order to more clearly show the technicalfeatures of the embodiments of the present disclosure.

Referring to FIG. 1A, a switching substrate 11 is provided. In someembodiments, the material of the switching substrate 11 may includeglass, sapphire, any other applicable material, or a combinationthereof, but the present disclosure is not limited thereto.

Referring to FIG. 1A, a plurality of first conductive members 21 (onlyone first conductive member 21 is shown in FIG. 1A) are formed on theswitching substrate 11. In some embodiments, the material of the firstconductive member 21 may include a conductive material, such as metal,metal silicide, the like, or a combination thereof, but the presentdisclosure is not limited thereto. For example, metal may include gold(Au), nickel (Ni), platinum (Pt), palladium (Pd), iridium (Ir), titanium(Ti), chromium (Cr), tungsten (W), aluminum (Al), copper (Cu), any otherapplicable metal, an alloy thereof, or a combination thereof, but thepresent disclosure is not limited thereto.

In some embodiments, the material of the first conductive member 21 maybe formed on the switching substrate 11 by a deposition process. Thedeposition process may include physical vapor deposition (PVD), chemicalvapor deposition (CVD), atomic layer deposition (ALD), evaporation,sputtering, any other applicable process, or a combination thereof, butthe present disclosure is not limited thereto.

Then, a patterning process may be performed on the material of the firstconductive member 21 to form a plurality of first conductive members 21.In some embodiments, the patterning process includes forming a masklayer (not illustrated) on the material of the first conductive member21, and then etching the portion that is not covered by the mask layerto form a plurality of first conductive members 21.

In some embodiments, the etching process may include a dry etchingprocess, a wet etching process, or a combination thereof. For example,the dry etching process may include reactive ion etch (ME),inductively-coupled plasma (ICP) etching, neutral beam etching (NBE),electron cyclotron resonance (ERC) etching, the like, or a combinationthereof, but the present disclosure is not limited thereto. For example,the wet etching process may use, for example, hydrofluoric acid (HF),ammonium hydroxide (NH₄OH), or any suitable etchant.

As shown in FIG. 1A, in some embodiments, when forming the firstconductive members, a plurality of first dummy conductive members 21′may be simultaneously formed, but the present disclosure is not limitedthereto. In some embodiments, each first dummy conductive member 21′ isadjacent to one first conductive member 21. The material and formingmethod of the first dummy conductive member 21′ may be the same as orsimilar to those of the first conductive member 21, and will not bedescribed in detail here.

Referring to FIG. 1B, a first insulating layer 31 is formed on the firstconductive members 21. In the embodiment shown in FIG. 1B, the firstinsulating layer 31 is also formed on the first dummy conductive members21′. In some embodiments, the material of the first insulating layer 31may include, for example, an oxide such as silicon oxide, a nitride suchas silicon nitride, any other applicable material, or a combinationthereof, but the present disclosure is not limited thereto. In someembodiments, the first insulating layer 31 may be formed on the firstconductive members 21 and the first dummy conductive members 21′ by adeposition process. For example, the deposition process may includemetal organic chemical vapor deposition (MOCVD), atomic layer deposition(ALD), molecular beam epitaxy (MBE), liquid phase epitaxy (LPE), anyother applicable process, or a combination thereof, but the presentdisclosure is not limited thereto.

Referring to FIG. 1C, a plurality of first semiconductor layers 41 (onlyone first semiconductor layer 41 is shown in FIG. 1C) are formed on thefirst insulating layer 31. In some embodiments, the material of thefirst semiconductor layer 41 may include n-type or p-type dopedamorphous silicon (a-Si), indium gallium zinc oxide (IGZO), organic thinfilm transistor (OTFT), and so on, and may be doped using a dopant, butthe present disclosure is not limited thereto. In some embodiments, thefirst semiconductor layers 41 may be formed on the first insulatinglayer 31 by a deposition process. The examples of the deposition processare as described above and will not be repeated here.

As shown in FIG. 1C, in some embodiments, when forming the semiconductorlayer 41, a plurality of dummy semiconductor layers 41′ may besimultaneously formed on the first insulating layer 31, and each dummysemiconductor layer 41′ is formed correspondingly on the first dummyconductive member 21′. The material and forming method of the dummysemiconductor layer 41′ may be the same as or similar to those of thefirst semiconductor layer 41, and will not be described in detail here.

Referring to FIG. 1D, a plurality of second conductive members 23 andthird conductive members 25 (only one second conductive member 23 andone third conductive member 25 are shown in FIG. 1D) are formed on thefirst conductive layers 41. In the embodiment shown in FIG. 1D, aportion of the second conductive member 23 and a portion of the thirdconductive member 25 may be in direct contact with the first insulatinglayer 31. In some embodiments, the second conductive members 23 and thethird conductive members 25 may be simultaneously formed. For example, aconductive material may be formed on the first semiconductor layers 41and the first insulating layer 31, and then a patterned process may beperformed to form the second conductive members 23 and the thirdconductive members 25, but the present disclosure is not limitedthereto. In some embodiments, the material and forming method of thesecond conductive member 23 and the third conductive member 25 may bethe same as or similar to those of the first conductive member 21, andwill not be described in detail here. Moreover, the second conductivemember 23 and the third conductive member 25 are separated from eachother (electrically isolated from each other).

As shown in FIG. 1D, in some embodiments, when forming the secondconductive members 23 and the third conductive members 25, a pluralityof second dummy conductive members 23′ may be simultaneously formed onthe dummy semiconductor members 41′. The material and forming method ofthe second dummy conductive member 23′ may be the same as or similar tothose of the second conductive member 23 (or the third conductive member25), and will not be described in detail here.

Referring to FIG. 1E, a second insulating layer 33 is formed on thesecond conductive members 23 and the third conductive members 25. In theembodiment shown in FIG. 1E, the second insulating layer 33 is alsoformed on the second dummy conductive members 23′. In some embodiments,the material and forming method of the second insulating layer 33 may bethe same as or similar to those of the first insulating layer 31, andwill not be described in detail here.

As shown in FIG. 1E, the second insulating layer 33 may have a throughhole 33H that exposes at least a portion of the surface of the thirdconductive member 25, but the present disclosures is not limitedthereto. In some other embodiments, the through hole 33H may expose atleast a portion of the surface of the second conductive member 23.

Referring to FIG. 1F, a plurality of connecting members 51 (only oneconnecting member 51 is shown in FIG. 1F) are formed on the secondinsulating layer 33. In some embodiments, the material of the connectingmember 51 may include metal. For example, metal may include gold (Au),nickel (Ni), platinum (Pt), palladium (Pd), iridium (Ir), titanium (Ti),chromium (Cr), tungsten (W), aluminum (Al), copper (Cu), any otherapplicable metal, an alloy thereof, or a combination thereof, but thepresent disclosure is not limited thereto. In some embodiments, theconnecting members 51 may be formed by physical vapor deposition (PVD),chemical vapor deposition (CVD), atomic layer deposition (ALD),evaporation, sputtering, any other applicable process, or a combinationthereof, but the present disclosure is not limited thereto.

In the embodiments of the present disclosure, each connecting member 51may be electrically connected to one of the second conductive member 23and the third conductive member 25. As shown in FIG. 1F, the connectingmember 51 may be in direct contact with the third conductive member 25through the through hole 33H of the second insulating layer 33, so thatthe connecting member 51 may be electrically connected to the thirdconductive member 25, but the present disclosure is not limited thereto.In some other embodiments, the connecting member 51 may be in directcontact with the second conductive member 23, so that the connectingmember 51 may be electrically connected to the second conductive member23.

As shown in FIG. 1F, in some embodiments, the first conductive members21, the first insulating layer 31, the first semiconductor layers 41,the second conductive members 23, and the third conductive members 25may define a plurality of switching elements 15. That is, in someembodiments, the switching structure 100 may include a plurality ofswitching elements 15. Moreover, the first conductive member 21 may be,for example, the gate electrode of the switching structure 100, and thesecond conductive member 23 and the third conductive member 25 may be,for example, the source electrode/drain electrodes of the switchingstructure 100.

As shown in FIG. 1F, in some embodiments, at least one grounding member53 may be formed on the second insulating layer 33. For example, thematerial and forming method of the grounding member 53 may be the sameas or similar to those of the connecting member 51. In addition, thegrounding member 53 is electrically connected to the switching elements15. It should be noted that the number of grounding members 53 is notlimited in the embodiments of the present disclosure. For example, insome embodiments, the number of ground members 53 is the same as thenumber of switching elements 15. That is, the switching elements 15 areelectrically connected to the corresponding ground members 53,respectively, but the present disclosure is not limited thereto. In someother embodiments, the number of ground member 53 may also be one. Thatis, all switching elements 15 may be electrically connected to a commonground member 53.

In the embodiment shown in FIG. 1F, since the connecting member 51 isstacked on the first dummy conductive member 21′, the first insulatinglayer 31, the second dummy conductive member 23′, the second insulatinglayer 33, and the dummy semiconductor layers 41′, the top surface 51T ofthe connecting member 51 may be higher than the top surface 33T of thesecond insulating layer 33. Here, the top surface 51T of the connectingmember 51 is the topmost surface of the connecting member 51 in thenormal direction of the switching structure 100, and the top surface 33Tof the second insulating layer 33 is the topmost surface of the secondinsulating layer 33 in the normal direction of the switching structure100. In other words, the distance D1 between the top surface 51T of theconnecting member 51 and the top surface 11T of the switching substrate11 is greater than the distance D2 between the top surface 33T of thesecond insulating layer 33 and the top surface 11T of the switchingsubstrate 11.

However, the present disclosure is not limited thereto. In some otherembodiments, the switching structure 100 may exclude the first dummyconductive member 21′, the second dummy conductive member 23′, and thedummy semiconductor layer 41′. In these embodiments, the top surface 51Tof the connecting member 51 may be higher than the top surface 33T ofthe second insulating layer 33 by adjusting the thickness of the firstinsulating layer 31 or the thickness of the second insulating layer 33,or changing the thickness of the connecting member 51 to be variable(not constant).

In other words, the switching structure 100 according to the embodimentof the present disclosure includes a switching substrate 11. Theswitching structure 100 also includes a plurality of first conductivemembers 21 disposed on the switching substrate 11. The switchingstructure 100 further includes a first insulating layer 31 disposed onthe first conductive members 21. The switching structure 100 includes aplurality of first semiconductor layers 41 disposed on the firstinsulating layer 31. The switching structure 100 also includes aplurality of second conductive members 23 and third conductive members25 disposed on the first conductive layers 41. The switching structure100 further includes a second insulating layer 33 disposed on the secondconductive members 23 and the third conductive members 25. Moreover, theswitching structure 100 includes a plurality of connecting members 51disposed on the second insulating layer 33. Each of the connectingmembers 51 is electrically connected to one of the second conductivemembers 23 or one of the third conductive members 25, and the topsurface 51T of each of the connecting members 51 is higher than the topsurface 33T of the second insulating layer 33.

FIGS. 2A-2E are cross-sectional views illustrating various stages ofmanufacturing the light-emitting structure 200 according to oneembodiment of the present disclosure. It should be noted that somecomponents may be omitted in FIGS. 2A-2E in order to more clearly showthe technical features of the embodiments of the present disclosure.

Referring to FIG. 2A, a carrier substrate 13 is provided. In someembodiments, the carrier substrate 13 may be a bulk semiconductorsubstrate or include a composite substrate formed of differentmaterials, and the carrier substrate 13 may be doped (for example, usingp-type or n-type dopants) or undoped. In some embodiments, the carriersubstrate 13 may include a semiconductor substrate, a glass substrate,or a ceramic substrate, such as a silicon substrate, a silicon germaniumsubstrate, a silicon carbide, an aluminum nitride substrate, a sapphiresubstrate, any other applicable substrate, or a combination thereof, butthe present disclosure is not limited thereto. In some embodiments, thecarrier substrate 13 may include a semiconductor-on-insulator (SOI)substrate formed by disposing a semiconductor material on an insulatinglayer.

Referring to FIG. 2A, a common conductive layer 55 is formed on thecarrier substrate. In some embodiments, the material of the commonconductive layer 55 may include metal. For example, metal may includegold (Au), nickel (Ni), platinum (Pt), palladium (Pd), iridium (Ir),titanium (Ti), chromium (Cr), tungsten (W), aluminum (Al), copper (Cu),any other applicable metal, an alloy thereof, or a combination thereof,but the present disclosure is not limited thereto. In some embodiments,the common conductive layer 55 may be formed by physical vapordeposition (PVD), chemical vapor deposition (CVD), atomic layerdeposition (ALD), evaporation, sputtering, any other applicable process,or a combination thereof, but the present disclosure is not limitedthereto.

Referring to FIG. 2B, a plurality of second semiconductor layers 43(only one second semiconductor layer 43 is shown in FIG. 2B) are formedon the common conductive layer 55. That is, the common conductive layer55 may be formed between the carrier substrate 13 and the secondsemiconductor layers 43, but the present disclosure is not limitedthereto. In some other embodiments, a plurality of second semiconductorlayers 43 may be directly formed on the carrier substrate 13 without thecommon conductive layer 55. In some embodiments, the material andforming method of the second semiconductor layer 43 may be the same asor similar to those of the first semiconductor layer 41, and will not bedescribed in detail here.

Referring to FIG. 2C, a plurality of active layers 61 (only one activelayer 61 is shown in FIG. 2C) are formed on the second semiconductorlayers 43. In some embodiments, the material of the active layer 61 mayinclude gallium antimonide (GaSb), gallium arsenide (GaAs), indiumphosphide (InP), silicon-germanium (SiGe), gallium nitride (GaN), anyother applicable material, or a combination thereof, but the presentdisclosure is not limited thereto. For example, when the light-emittingstructure 200 is to emit red light, the material of the active layer 61may further include aluminum gallium indium phosphide (InGaALP); whenthe light-emitting structure 200 is to emit green/blue light, thematerial of the active layer 61 may further include indium galliumnitride (InGaN). Moreover, the active layers 61 may be formed on thesecond semiconductor layers 43 by a deposition process. The examples ofthe deposition process are as described above and will not be repeatedhere.

Referring to FIG. 2D, a plurality of third semiconductor layers 45 (onlyone third semiconductor layer 45 is shown in FIG. 2D) are formed on theactive layers 61. In some embodiments, the material and forming methodof the third semiconductor layer 45 may be the same as or similar tothose of the first semiconductor layer 41 or the second semiconductorlayer 43, but the conductivity type of the third semiconductor layer 45is different from the conductivity type of the second semiconductorlayer 43, which will not be described in detail here.

Referring to FIG. 2E, a plurality of fourth conductive members 57 (onlyone fourth conductive member 57 is shown in FIG. 2E) are formed on thethird semiconductor layers 45 to form the light-emitting structure 200.In some embodiments, the material and forming method of the fourthconductive member 57 may be the same as or similar to those of theconnecting member 51, and will not be described in detail here.

As shown in FIG. 2E, in some embodiments, the second semiconductorlayers 43, the active layers 61, the third semiconductor layers 45, andthe fourth conductive members 57 may define a plurality oflight-emitting elements 17. That is, the light-emitting structure 200may include a plurality of light-emitting elements 17.

In other words, the light-emitting structure 200 according to theembodiment of the present disclosure includes a carrier substrate 13.The light-emitting structure 200 also includes a plurality of secondsemiconductor layers 43 disposed on the carrier substrate 13. Thelight-emitting structure 200 further includes a plurality of activelayers 61 disposed on the second semiconductor layers 43. Thelight-emitting structure 200 includes a plurality of third semiconductorlayers 45 disposed on the active layers 61. The light-emitting structure200 also includes a plurality of fourth conductive members 57 disposedon the third semiconductor layers 57.

FIG. 3A is a cross-sectional view illustrating a display device 1according to one embodiment of the present disclosure. FIG. 3B is anexample of a partial top view of the display device 1. FIG. 3C isanother example of a partial top view of the display device 1.Similarly, some components may be omitted in FIGS. 3A-3C in order tomore clearly show the technical features of the embodiments of thepresent disclosure.

Referring to FIG. 3A, the light-emitting structure 200 shown in FIG. 2Eis arranged on the switching structure 100 shown in FIG. 1F, so thateach light-emitting element 17 is above one switching element 15. Then,each light-emitting element 17 is connected to the correspondingswitching element 15 via a laser LS to form the display device 1. Inparticular, each fourth conductive member 57 may be connected to oneconnecting element 15 via the laser LS as shown in FIG. 3A.

In other words, the display device 1 according to the embodiment of thepresent disclosure includes a switching structure 100 that includes aplurality of switching elements 15. The display device 1 also includes alight-emitting structure 200 disposed on the switching structure 100,and the light-emitting structure 200 includes a plurality oflight-emitting elements 17. Each of the light-emitting elements 17 isdisposed correspondingly on one of the switching elements 15, and eachof the light-emitting elements 17 is connected to the correspondingswitching element 15. That is, the light-emitting elements 17 (e.g.,micro LED chips) of the light-emitting structure 200 may be stacked onthe corresponding switching elements 15 (e.g., thin film transistor(TFT)) in the switching structure 100.

In this embodiment, a portion of the display device 1 shown in FIG. 3Amay be, for example, a cross-sectional view of the display device 1along line A-A′ in FIG. 3B or along line B-B′ in FIG. 3C, but thepresent disclosure is not limited thereto. In some other embodiments,the top view of the display device 1 may be different from FIG. 3B orFIG. 3C, and may be designed according to actual needs.

Since the top surface 51T of the connecting member 51 may be higher thanthe top surface 33T of the second insulating layer 33 of the switchingstructure 100 according to the embodiments of the present disclosure,the light-emitting elements 17 (e.g., micro LED chips) of thelight-emitting structure 200 may be stacked on the correspondingswitching elements 15 (e.g., thin film transistor (TFT)) in theswitching structure 100, and each light-emitting element 17 may beconnected to the corresponding switching element 15 via a laser LS.Therefore, the size of a single pixel may be effectively reduced toachieve high resolution.

Moreover, since each light-emitting element 17 is connected to thecorresponding switching element 15 via a laser in the manufacturingmethod of the display device according to the embodiments of the presentdisclosure, it does not require a complicated process or use morephotomasks. As a result, the display device 1 with high resolution maybe completed at a lower manufacturing cost.

As shown in FIG. 3A, in some embodiments, the switching structure 100may include a common grounding member 59 that may be formed on thesecond insulating layer 33 and electrically connected to all switchingelements 15. Moreover, in the embodiment shown in FIG. 3A, the displaydevice 1 may further include a common conductive structure 65 that isdisposed between the switching structure 100 and the light-emittingstructure 200 and in direct contact with the common grounding member 59of the switching structure 100 and the common conductive layer 55 of thelight-emitting structure 200. In some embodiments, the common conductivestructure 65 may be, for example, a conductive ball, but the presentdisclosure is not limited thereto.

FIG. 4 is a cross-sectional view illustrating a display device 3according to another embodiment of the present disclosure. Similarly,some components may be omitted in FIG. 4 in order to more clearly showthe technical features of the embodiments of the present disclosure.Moreover, a portion of the display device 3 shown in FIG. 4 may be, forexample, a cross-sectional view along line A-A′ in FIG. 3B or along lineB-B′ in FIG. 3C, but the present disclosure is not limited thereto.

The display device 3 shown in FIG. 4 has a similar structure to thedisplay device 1 shown in FIG. 3A. The difference from the displaydevice 1 shown in FIG. 3A is that the light-emitting structure 200′ ofthe display device 3 shown in FIG. 4 does not include the carriersubstrate 13. In other words, the plurality of light-emitting elements17 may be directly formed on the common conductive layer 55.

FIG. 5 is a cross-sectional view illustrating a display device 5according to another embodiment of the present disclosure. Similarly,some components may be omitted in FIG. 5 in order to more clearly showthe technical features of the embodiments of the present disclosure.Moreover, a portion of the display device 5 shown in FIG. 5 may be, forexample, a cross-sectional view along line A-A′ in FIG. 3B or along lineB-B′ in FIG. 3C, but the present disclosure is not limited thereto.

The display device 5 shown in FIG. 5 has a similar structure to thedisplay device 1 shown in FIG. 3A. The difference from the displaydevice 1 shown in FIG. 3A is that the switching structure 100′ of thedisplay device 5 shown in FIG. 5 does not include the first dummyconductive member 21′, the second dummy conductive member 23′, and thedummy semiconductor layers 41′. In this embodiment, the thickness of theconnecting member 51′ of the switching structure 100′ is variable (notconstant), so that the top surface of the connecting member 51′ may behigher than the top surface of the second insulating layer 33, but thepresent disclosure is not limited thereto. In some other embodiments,the top surface of the connecting member 51′ may be higher than the topsurface of the second insulating layer 33 by adjusting the thickness ofthe first insulating layer 31 or the thickness of the second insulatinglayer 33.

In the foregoing embodiments, the second semiconductor layer 43 isaligned with the active layer 61, the third semiconductor layer 45, andthe fourth conductive member 57 disposed on the second semiconductorlayer 43, but the present disclosure is not limited thereto. FIG. 6 is across-sectional view illustrating a display device 7 according toanother embodiment of the present disclosure. Similarly, some componentsmay be omitted in FIG. 6 in order to more clearly show the technicalfeatures of the embodiments of the present disclosure.

The display device 7 shown in FIG. 6 has a similar structure to thedisplay device 5 shown in FIG. 5. The difference from the display device5 shown in FIG. 5 is that the light-emitting structure 200 of thedisplay device 7 shown in FIG. 6 does not include the common conductivelayer 55, and the width of the second semiconductor layer 43′ is greaterthan the widths of the active layer 61, the third semiconductor layer45, and the fourth conductive member 57 disposed on the secondsemiconductor layer 43′. That is, at least a portion of the secondsemiconductor layer 43′ exceeds the active layer 61, the thirdsemiconductor layer 45, and the fourth conductive member 57 in thehorizontal direction of FIG. 6.

In this embodiment, the number of ground members 53′ of the switchingstructure 100′ is the same as the number of switching elements 15′ ofthe switching structure 100′, and each light-emitting element 17′ is(electrically) connected to the corresponding switching element 15′through the respective conductive structure 65′. Therefore, the displaydevice may not include the common conductive structure 65.

FIGS. 7A-7C are cross-sectional views illustrating various stages ofcombining the light-emitting structure 200 and the switching structure100 according to one embodiment of the present disclosure. It should benoted that some components may be omitted in FIGS. 7A-7C in order tomore clearly show the technical features of the embodiments of thepresent disclosure.

Referring to FIG. 7A, in this embodiment, the switching substrate 11′ ofthe switching structure 100 may be a flexible substrate, and a pluralityof switching elements 15 are disposed on the flexible switchingsubstrate 11′. In this embodiment, the carrier substrate 13′ of thelight-emitting structure 200 is a curved rigid substrate, and aplurality of light-emitting elements 17 are disposed on a concavesurface 13C of the curved carrier substrate 13′.

Then, referring to FIG. 7B and FIG. 7C, a plurality of switchingelements 15 may be connected to the corresponding light-emittingelements 17 via the roller R and the laser LS, respectively, so that thelight-emitting structure 200 and the switching structure 100 arecombined. In this embodiment, a common conductive structure 65 may bedisposed between the light-emitting structure 200 and the switchingstructure 100, but the present disclosure is not limited thereto.

FIGS. 8A-8B are cross-sectional views illustrating various stages ofcombining the light-emitting structure 200 and the switching structure100 according to another embodiment of the present disclosure. It shouldbe noted that some components may be omitted in FIGS. 8A-8B in order tomore clearly show the technical features of the embodiments of thepresent disclosure.

Referring to FIG. 8A, similarly, the switching substrate 11′ of theswitching structure 100 may be a flexible substrate, and a plurality ofswitching elements 15 are disposed on the flexible switching substrate11′. In this embodiment, the carrier substrate 13′ of the light-emittingstructure 200 is a curved rigid substrate, and a plurality oflight-emitting elements 17 are disposed on a convex surface 13P of thecurved carrier substrate 13′. In addition, in this embodiment, alaminating machine LM may be used to combine the light-emittingstructure 200 with the switching structure 100.

Referring to FIG. 8B, the switching structure 100 is placed in thelaminating machine LM, and a plurality of switching elements 15 arerespectively connected to the corresponding light-emitting elements 17via the laser LS, so that the light-emitting structure 200 and theswitching structure 100 are combined. Similarly, a common conductivestructure 65 may be disposed between the light-emitting structure 200and the switching structure 100, but the present disclosure is notlimited thereto.

In summary, by the manufacturing method of the display device accordingto the embodiments of the present disclosure, the light-emittingstructure may be stacked on the corresponding switching structure, andeach light-emitting element may be connected to the correspondingswitching element via a laser. Therefore, it may effectively reduce thesize of a single pixel to achieve high resolution.

Moreover, since each light-emitting element is connected to thecorresponding switching element via a laser in the manufacturing methodof the display device according to the embodiments of the presentdisclosure, it does not require a complicated process or use morephotomasks. As a result, a display device with high resolution may becompleted at a lower manufacturing cost.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure. Therefore, the scope of protection should bedetermined through the claims. In addition, although some embodiments ofthe present disclosure are disclosed above, they are not intended tolimit the scope of the present disclosure.

Reference throughout this specification to features, advantages, orsimilar language does not imply that all of the features and advantagesthat may be realized with the present disclosure should be or are in anysingle embodiment of the disclosure. Rather, language referring to thefeatures and advantages is understood to mean that a specific feature,advantage, or characteristic described in connection with an embodimentis included in at least one embodiment of the present disclosure. Thus,discussions of the features and advantages, and similar language,throughout this specification may, but do not necessarily, refer to thesame embodiment.

Furthermore, the described features, advantages, and characteristics ofthe disclosure may be combined in any suitable manner in one or moreembodiments. One skilled in the relevant art will recognize, in light ofthe description herein, that the disclosure can be practiced without oneor more of the specific features or advantages of a particularembodiment. In other instances, additional features and advantages maybe recognized in certain embodiments that may not be present in allembodiments of the disclosure.

What is claimed is:
 1. A manufacturing method of a display device,comprising: forming a switching structure, wherein the switchingstructure comprises a plurality of switching elements; forming alight-emitting structure, wherein the light-emitting structure comprisesa plurality of light-emitting elements; arranging the light-emittingstructure on the switching structure, so that each of the light-emittingelements is above each of the switching elements; and connecting each ofthe light-emitting elements to a corresponding switching element via alaser.
 2. The manufacturing method of the display device as claimed inclaim 1, wherein the step of forming the switching structure comprises:providing a switching substrate; forming a plurality of first conductivemembers on the switching substrate; forming a first insulating layer onthe first conductive members; forming a plurality of first semiconductorlayers on the first insulating layer; forming a plurality of secondconductive members and third conductive members on the first conductivelayers; forming a second insulating layer on the second conductivemembers and the third conductive members; and forming a plurality ofconnecting members on the second insulating layer, wherein each of theconnecting members is electrically connected to one of the secondconductive members or one of the third conductive members; wherein thefirst conductive members, the first insulating layer, the firstsemiconductor layers, the second conductive members, and the thirdconductive members define the switching elements, and each of theswitching elements is connected to each of the connecting members. 3.The manufacturing method of the display device as claimed in claim 2,wherein the step of forming the switching structure further comprises:forming at least one grounding member on the second insulating layer,wherein the at least one grounding member is electrically connected tothe switching elements.
 4. The manufacturing method of the displaydevice as claimed in claim 3, wherein a top surface of each of theconnecting members is higher than a top surface of the second insulatinglayer.
 5. The manufacturing method of the display device as claimed inclaim 3, wherein the step of forming the switching structure furthercomprises: when forming the first conductive members, simultaneouslyforming a plurality of first dummy conductive members, wherein each ofthe first dummy conductive members is adjacent to one of the firstconductive members; when forming the semiconductor layer, simultaneouslyforming a plurality of dummy semiconductor layers on the firstinsulating layer, wherein each of the dummy semiconductor layers isformed correspondingly on one of the first dummy conductive members; andwhen forming the second conductive members and the third conductivemembers, simultaneously forming a plurality of second dummy conductivemembers on the dummy semiconductor members; wherein the secondinsulating layer is formed on the second dummy conductive members. 6.The manufacturing method of the display device as claimed in claim 3,wherein the step of forming the light-emitting structure comprises:providing a carrier substrate; forming a plurality of secondsemiconductor layers on the carrier substrate; forming a plurality ofactive layers on the second semiconductor layers; forming a plurality ofthird semiconductor layers on the active layers; and forming a pluralityof fourth conductive members on the third semiconductor layers; whereinthe second semiconductor layers, the active layers, the thirdsemiconductor layers, and the fourth conductive members define thelight-emitting elements, and each of the fourth conductive members isconnected to each of the connecting members.
 7. The manufacturing methodof the display device as claimed in claim 6, further comprising: forminga common conductive layer between the carrier substrate and the secondsemiconductor layers.
 8. The manufacturing method of the display deviceas claimed in claim 7, wherein the at least one grounding member iselectrically connected to the common conductive layer.
 9. Themanufacturing method of the display device as claimed in claim 3,wherein the step of forming the light-emitting structure comprises:forming a common conductive layer; forming a plurality of secondsemiconductor layers on the common conductive layer; forming a pluralityof active layers on the second semiconductor layers; forming a pluralityof third semiconductor layers on the active layers; and forming aplurality of fourth conductive members on the third semiconductorlayers; wherein the second semiconductor layers, the active layers, thethird semiconductor layers, and the fourth conductive members define thelight-emitting structure, each of the fourth conductive members isconnected to each of the connecting members, and the at least onegrounding member is connected to the common conductive layer.
 10. Adisplay device, comprising: a switching structure comprising a pluralityof switching elements; and a light-emitting structure disposed on theswitching structure and comprising a plurality of light-emittingelements; wherein each of the light-emitting elements is disposedcorrespondingly on one of the switching elements, and each of thelight-emitting elements is connected to the one of the switchingelements.
 11. The display device as claimed in claim 10, wherein theswitching structure comprises: a switching substrate; a plurality offirst conductive members disposed on the switching substrate; a firstinsulating layer disposed on the first conductive members; a pluralityof first semiconductor layers disposed on the first insulating layer; aplurality of second conductive members and third conductive membersdisposed on the first semiconductor layers; a second insulating layerdisposed on the second conductive members and the third conductivemembers; and a plurality of connecting members disposed on the secondinsulating layer, wherein each of the connecting members is electricallyconnected to one of the second conductive members or one of the thirdconductive members, and a top surface of each of the connecting membersis higher than a top surface of the second insulating layer.
 12. Thedisplay device as claimed in claim 11, wherein the switching structurefurther comprises: at least one grounding member disposed on the secondinsulating layer and electrically connected to the switching elements.13. The display device as claimed in claim 12, wherein the switchingstructure further comprises: a plurality of first dummy conductivemembers, wherein each of the first dummy conductive members is adjacentto one of the first conductive members; a plurality of dummysemiconductor layers disposed on the first insulating layer andcorresponding to the first dummy conductive members; and a plurality ofsecond dummy conductive members disposed on the dummy semiconductormembers; wherein the second insulating layer is formed on the seconddummy conductive members.
 14. The display device as claimed in claim 12,wherein the light-emitting structure comprises: a carrier substrate; aplurality of second semiconductor layers disposed on the carriersubstrate; a plurality of active layers disposed on the secondsemiconductor layers; a plurality of third semiconductor layers disposedon the active layers; and a plurality of fourth conductive membersdisposed on the third semiconductor layers; wherein each of the fourthconductive members is connected to each of the connecting members. 15.The display device as claimed in claim 14, wherein the light-emittingstructure further comprises: a common conductive layer disposed betweenthe carrier substrate and the second semiconductor layers.
 16. Thedisplay device as claimed in claim 15, wherein the at least onegrounding member is electrically connected to the common conductivelayer.
 17. The display device as claimed in claim 12, wherein thelight-emitting structure comprises: a common conductive layer; aplurality of second semiconductor layers disposed on the commonconductive layer; a plurality of active layers disposed on the secondsemiconductor layers; a plurality of third semiconductor layers disposedon the active layers; and a plurality of fourth conductive membersdisposed on the third semiconductor layers; wherein each of the fourthconductive members is connected to each of the connecting members, andthe at least one grounding member is electrically connected to thecommon conductive layer.